Flip Chip Bonder For Discrete Devices, LED, SAW Filter, Quartz Oscillator
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Description
Features | |
● | High speed bonding of small chips |
● | Stable thermosonic bonding through newly developed transducer and very precise force control |
● | Applicable for several types of substrates by replacing conversion parts |
● | Compact body handles eight-inch wafers. Wafer auto loader can be installed |
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Flip Chip Bonder For Discrete Devices, LED, SAW Filter, Quartz Oscillator
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