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Description
| Features | |
| ● | Highly extensible platform capable of handling variety of bumping methods (Gold solder, NCP, Copper Pillar, TSV, COC) realized by adopting the modular system. |
| ● | High speed, high accuracy bonding achieved by adopting probe camera technology and Shinkawa NRS technology that neatly reduces vibration obstructing fine pitch bonding. |
| ● | High throughput achieved by quick heating and cooling with pulse heater. |
| ● | High precision force control and position control achieved by adopting linear motor to Z-axis. |
| ● | High cleanliness achieved by incorporating frictionless indexing mechanism and HEPA filter. |
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Flip Chip Bonder
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